Co-curable, conductive surfacing films for lightning strike and electromagnetic interference shielding of thermoset composite materials

ABSTRACT

Embodiments of the present disclosure present electrically conductive, thermosetting compositions for use in surfacing films and adhesives. The surfacing films possess enhanced electrical conductivity, comparable to metals, without the use of embedded metal screens or foils. Such surfacing films may be incorporated into composite structures (e.g., prepregs, tapes, and fabrics), for example, by co-curing, as an outermost surface layer. In particular, compositions formed using silver flakes as conductive fillers are found to exhibit very high electrical conductivity. For example, compositions including greater than 45 wt. % silver flake exhibit resistivities less than about 55 mΩ/sq. In this manner, the surfacing films as an outermost conductive layer may provide lighting strike protection (LSP) and electromagnetic interference (EMI) shielding when used in applications such as aircraft components.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation application of U.S. application Ser.No. 13/468,932, filed on May 10, 2012, which is a continuation of U.S.application Ser. No. 12/702,715, filed on Feb. 9, 2010, now U.S. Pat.No. 8,178,606, which claims benefit of priority from U.S. ProvisionalApplication No. 61/152,939, filed Feb. 16, 2009.

BACKGROUND

1. Field

Embodiments of the present disclosure pertain to electrically conductivepolymer compositions and, in particular, to surfacing and adhesive filmsformed from thermosetting polymer compositions that incorporateconductive additives.

2. Description of the Related Art

Polymer matrix composite structures (PMCs) are being increasingly usedfor aerospace applications. For example, PMCs have been employed inamounts up to about 50% in commercial aircraft. PMCs combine selectivelyoriented fibers that are enveloped in a surrounding polymeric matrixmaterial. These composite structures exhibit good mechanical propertiesfor their weight (e.g., strength, stiffness, toughness), as well as awide service temperature window and ease of manufacture, making themwell suited for aerospace applications.

Surfacing films, such as epoxy-based films, are often incorporated intopolymer composites to provide the composites with the surface qualityrequired for aerospace applications. For example, surfacing films may beco-cured with prepregs to provide a substantially porosity free surfacethat protects the underlying composite, while reducing labor, time, andcost of composite manufacturing.

Epoxy-based surfacing films, however exhibit poor resistance toelectromagnetic energy (EME) events, such as lightning strike (LS),electrostatic discharge (ESD), and electromagnetic interference (EMI)due to their insulative properties. The relatively high resistivityexhibited by epoxies inhibits the energy of a lightning strike fromdissipating adequately, resulting in skin puncture and delamination ofthe underlying composite structure. Further, the charge generated on thesurface of the composite can remain for long time periods, elevating therisk of ESD in low relative humidity environments that can damageelectronic systems and risk sparking in the vapor space of fuel tanks.Additionally, the poor electrical conductivity of epoxy-based surfacingfilms may inhibit the mobility of charge carriers, which can impair theability of the composite structure to provide EMI shielding.

To minimize the effect of lightning strike on a composite structure,different ways of enhancing the conductivity of the composite structurehave been used to provide LS/ESD/EMI protection for composite parts onaircraft. Examples of such approaches include solid or segmenteddiverters, arc-sprayed or flame-sprayed metals, woven wire meshes,solid/expanded/perforated foils, metal coated fiber cloths, interwovenwire fabric (IWWF) highly conductive fibers, and metal loaded conductivepaints. In further examples, expanded metal screens (e.g., copper,aluminum mesh) have been embedded in surfacing films attached on acomposite surface to dissipate the energy incurred by lighting strikefor protection against such events.

Detrimentally, however, surfacing film systems with embedded metalscreens (e.g., copper or aluminum, with fiberglass isolation layer)significantly increase the overall weight of the aircraft. Furthermore,integrating these surfacing film systems into composite materials maysignificant increase the materials and labor costs for the manufactureof the composite parts. Additionally, it may be difficult tointerconnect these surfacing films in a manner that achievessubstantially uniform conductivity across many surfacing films,resulting in conductivity discontinuities that may result in enhancedlikelihood of damage during LS or ESD and/or impaired EMI shielding. Inparticular, metallic screens are further subject to corrosion, thermalexpansion mismatch with the matrix that leads to micro-cracking, andimpaired bonding with the matrix, each of which may further diminish theLS/ESD/EMI protection afforded by the surfacing film.

SUMMARY

In an embodiment, an electrically conductive surfacing film is provided.The surfacing film comprises

a thermosetting polymer composition comprising:

at least one thermosetting resin; and

at least one conductive additive comprising greater than about 35 wt. %silver flakes, on the basis of the total weight of the composition;

where the resistivity of the surfacing film is less than about 500mΩ/sq.

In another embodiment, an electrically conductive surfacing film isprovided. The surfacing film comprises:

a thermosetting polymer composition comprising:

at least one thermosetting resin; and

about 2-8 wt. % electrically conductive carbon black;

wherein the resistivity of the surfacing film is less than about 50Ω/sq.

In a further embodiment, a composite comprising the surfacing film isprovided.

In an additional embodiment, an electrically conductive composition isprovided. The composition comprises:

about 10-60 wt. % of one or more thermosetting resins;

about 0.5-30 wt. % of one or more curing agents; and

about 2-70 wt. % of one or more conductive additives;

where the concentrations are determined on the basis of the total weightof the composition; and

where the concentration of conductive additives is selected such theconductive composition exhibits a resistivity ranging between about1×10⁻⁶ Ω/sq to 1×10⁸ Ω/sq.

In an embodiment, a surfacing film comprising the composition isprovided. In another embodiment, a composite comprising the surfacingfilm is provided. In a further embodiment a conductive adhesive filmcomprising the composition is provided.

In an additional embodiment, a method of forming a conductive surfacingfilm is provided. The method comprises:

providing the electrically conductive composition; and

applying the electrically conductive composition to a carrier.

In a further embodiment, a method of forming a composite is provided. Inone embodiment, the method comprises co-curing the surfacing film with acomposite prepreg. In another embodiment, the method comprises adheringthe surfacing film to a composite material.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a flow diagram of an embodiment of a method of formingelectrically conductive, thermosetting compositions and articlestherefrom;

FIG. 2 is a flow diagram of an embodiment of a method of forming acomposite from an embodiment of the electrically conductivethermosetting composition;

FIG. 3 is a schematic illustration a prepreg layup integrating asurfacing film formed from an embodiment of the electrically conductivethermosetting composition;

FIG. 4A is a scanning electron microscope (SEM) micrographs of across-section of a surfacing film including a conductive additive ofsilver flakes, illustrating a lamellar morphology adopted by the silverflakes;

FIG. 4B is an SEM micrograph of a fracture surface of a surfacing filmformed from an embodiment of the electrically conductive polymercomposition comprising silver flakes;

FIG. 5A is a plot of resistivity as a function of conductive additivefor surfacing films formed from embodiments the electrically conductivethermosetting composition;

FIG. 5B is a plot of resistivity as a function of concentration forsurfacing films formed from embodiments the electrically conductivethermosetting composition including conductive carbon black and carbonnanofibers;

FIG. 6 is a plot of resistivity as a function of concentration of twodifferent silver flakes for surfacing films formed from embodiments theelectrically conductive thermosetting composition;

FIG. 7 is a plot of resistivity as a function of concentration of silverflakes, along and with other conductive additives (Silver Nanowire,Carbon Nanotubes, and meta-coated balloons) for surfacing films formedfrom embodiments the electrically conductive thermosetting composition;

FIGS. 8A-8B are front-view pictures of composite panels incorporatingsurfacing films after Zone 1A lightning strike testing; (A) unpaintedcontrol surfacing film; (B) unpainted surfacing film containing silverflake;

FIGS. 9A-9B are front-view pictures of composite panels incorporatingsurfacing films after Zone 1A lightning strike testing; (A) paintedcontrol surfacing film; (B) painted surfacing film containing silverflake; and

FIGS. 10A-10B are front-view pictures of composite panels incorporatingsurfacing films after Zone 2A lightning strike testing; (A) unpaintedsurfacing film containing silver flake; (B) painted surfacing filmcontaining silver flake.

DETAILED DESCRIPTION

The terms “approximately”, “about”, and “substantially” as used hereinrepresent an amount close to the stated amount that still performs adesired function or achieves a desired result. For example, the terms“approximately”, “about”, and “substantially” may refer to an amountthat is within less than 10% of, within less than 5% of, within lessthan 1% of, within less than 0.1% of, and within less than 0.01% of thestated amount.

The term “room temperature” as used herein has its ordinary meaning asknown to those skilled in the art and may include temperatures withinthe range of about 16° C. (60° F.) to 32° C. (90° F.).

The term “fiber” as used herein has its ordinary meaning as known tothose skilled in the art and may include one or more fibrous materialsadapted for the reinforcement of composites. Fibers may take the form ofwhiskers, short fibers, continuous fibers, filaments, tows, bundles,sheets, plies, and combinations thereof. Continuous fibers may furtheradopt any of unidirectional, multi-dimensional (e.g., two- orthree-dimensional), non-woven, woven, knitted, stitched, wound, andbraided configurations, as well as swirl mat, felt mat, and chopped matstructures. Woven fiber structures may comprise a plurality of woventows having less than about 1000 filaments, less than about 3000filaments, less than about 6000 filaments, less than about 12000filaments, less than about 24000 filaments, less than about 48000filaments, less than about 56000 filaments, and less than about 125000filaments. In further embodiments, the tows may be held in position bycross-tow stitches, weft-insertion knitting stitches, or a small amountof resin, such as a thermoplastic resin.

The composition of the fibers may be varied, as necessary. Embodimentsof the fiber composition may include, but are not limited to, glass,carbon, aramid, quartz, polyethylene, polyester,poly-p-phenylene-benzoxazole (PBO), boron, polyamide, carbon, andgraphite, silicon carbide, silicon nitride, Astroquartz®, Tyranno®,Nextel®, and Nicalon®, and combinations thereof.

The term, “resin” as used herein has its ordinary meaning as known tothose skilled in the art and may include one or more compoundscomprising thermoset and/or thermoplastic materials. Examples mayinclude, but are not limited to, epoxies, epoxy curing agents,phenolics, phenols, cyanate esters, polyimides (e.g., bismaleimide (BMI)and polyetherimides), polyesters, benzoxazines, polybenzoxazines,polybenzoxazones, polybenzimidazoles, polybenzothiazoles, polyamides,polyamidimides, polysulphones, polyether sulphones, polycarbonates,polyethylene terephthalates, cyanates, cyanate esters, and polyetherketones (e.g. polyether ketone (PEK), polyether ether ketone (PEEK),polyether ketone ketone (PEKK) and the like), combinations thereof, andprecursors thereof.

Epoxy resins may further include polyepoxides having at least about twoepoxy groups per molecule. The polyepoxides may be saturated,unsaturated, cyclic, or acyclic, aliphatic, alicyclic, aromatic, orheterocyclic. Examples of suitable polyepoxides include the polyglycidylethers, which are prepared by reaction of epichlorohydrin orepibromohydrin with a polyphenol in the presence of alkali. Suitablepolyphenols therefor are, for example, resorcinol, pyrocatechol,hydroquinone, bisphenol A (bis(4-hydroxyphenyl)-2,2-propane), bisphenolF (bis(4-hydroxyphenyl)methane), bis(4-hydroxyphenyl)-1,1-isobutane,4,4′-dihydroxybenzophenone, bis(4-hydroxyphenyl)-1,1-ethane, and1,5-hydroxynaphthalene. Other suitable polyphenols as the basis for thepolyglycidyl ethers are the known condensation products of phenol andformaldehyde or acetaldehyde of the novolak resin-type.

Other polyepoxides may include the polyglycidyl ethers of polyalcoholsor diamines. Such polyglycidyl ethers are derived from polyalcohols,such as ethylene glycol, diethylene glycol, triethylene glycol,1,2-propylene glycol, 1,4-butylene glycol, triethylene glycol,1,5-pentanediol, 1,6-hexanediol or trimethylolpropane.

Additional polyepoxides may include polyglycidyl esters ofpolycarboxylic acids, for example, reaction products of glycidol orepichlorohydrin with aliphatic or aromatic polycarboxylic acids, such asoxalic acid, succinic acid, glutaric acid, terephthalic acid or adimeric fatty acid.

Other epoxides may include those derived from the epoxidation productsof olefinically-unsaturated cycloaliphatic compounds or from naturaloils and fats.

Other epoxides may include liquid epoxy resins derived by reaction ofbisphenol A or bisphenol F and epichlorohydrin. The epoxy resins thatare liquid at room temperature generally have epoxy equivalent weightsof from 150 to about 480.

Epoxy resins that are solid at room temperature may also, oralternatively, be used and are likewise obtainable from polyphenols andepichlorohydrin, for example, those based on bisphenol A or bisphenol Fhaving a melting point of from 45 to 130° C., preferably from 50 to 80°C. These differ from the liquid epoxy resins substantially by the highermolecular weight thereof, as a result of which they become solid at roomtemperature. The solid epoxy resins generally have an epoxy equivalentweight of greater than or equal to 400.

The terms “cure” and “curing” as used herein have their ordinary meaningas known to those skilled in the art and may include polymerizing and/orcross-linking processes. Curing may be performed by processes thatinclude, but are not limited to, heating, exposure to ultraviolet light,and exposure to radiation. In certain embodiments, curing may take placewithin the matrix. Prior to curing, the matrix may further comprise oneor more compounds that are, at about room temperature, liquid,semi-solid, crystalline solids, and combinations thereof. In furtherembodiments, the matrix within a prepreg may be partially cured in orderto exhibit a selected stickiness or tack. In certain embodiments,consolidation and curing may be performed in a single process.

The term “consolidation” as used herein has its ordinary meaning asknown to those skilled in the art and may include processes in which theresin or matrix material flows so as to displace void space within andadjacent fibers. For example, “consolidation” may include, but is notlimited to, flow of matrix into void spaces between and within fibersand prepregs, and the like. “Consolidation” may further take place underthe action of one or more of heat, vacuum, and applied pressure.

The term “impregnate” as used herein has its ordinary meaning as knownto those skilled in the art and may include the introduction of a matrixmaterial between or adjacent to one or more fibers. The matrix may takethe form of films, powders, liquids, and combinations thereof.Impregnation may be facilitated by the application of one or more ofheat, pressure, and solvents.

The term “prepreg” as used herein has its ordinary meaning as known tothose skilled in the art and may include sheets or lamina of fibers thathave been impregnated with a matrix material. The matrix may also bepresent in a partially cured state.

The terms “layup” and “prepreg layup” as used herein has their ordinarymeaning as known to those skilled in the art and may include one or moreprepreg layers that are placed adjacent one another. In certainembodiments, the prepreg layers within the layup may be positioned in aselected orientation with respect to one another. For example, prepreglayups may comprise prepreg layers having unidirectional fiberarchitectures, with the fibers oriented at 0°, 90°, a selected angle θ,and combinations thereof, with respect to the largest dimension of thelayup, such as the length. It may be further understood that, in certainembodiments, prepregs having any combination of fiber architectures,such as unidirectional and multi-dimensional, may be combined to formthe prepreg layup.

In further embodiments, prepreg layers may optionally be stitchedtogether with a threading material in order to inhibit their relativemotion from a selected orientation. Layups may be manufactured bytechniques that may include, but are not limited to, hand layup,automated tape layup (ATL), advanced fiber placement (AFP), and filamentwinding.

Embodiments of the present disclosure present electrically conductive,thermosetting compositions for use in surfacing films and adhesives, aswell as corresponding methods of fabrication. The surfacing films formedfrom the composition possess enhanced electrical conductivity,comparable to metals, without the use of embedded metal screens orfoils. Such surfacing films may be incorporated into compositestructures (e.g., prepregs, tapes, and fabrics), for example, byco-curing, as an outermost surface layer. In this manner, the surfacingfilms as an outermost conductive layer may provide lighting strikeprotection (LSP) and electromagnetic interference (EMI) shielding whenused in applications such as aircraft components.

In certain embodiments, the enhanced electrical conductivity of thesurfacing films may be achieved by combination of thermosetting polymerswith electrically conductive additives, such as metal flakes and/orconductive nanoparticles dispersed substantially uniformly throughout oron the film. Beneficially, these compositions may substantially reducethe need for the use of relatively heavy, metal screens enhance theelectrical conductivity of surfacing films, providing substantialreductions in weight. For example, weight savings of about 50 to 80% maybe achieved as compared to conductive surfacing films embedded withmetal screens. The absence of such screens and foils in embodiments ofthe surfacing films disclosed herein may further facilitate ease ofmanufacturing and reduce the cost of composite components formed withthese surfacing films.

In particular, it has been discovered that embodiments of polymercompositions comprising conductive additives of silver flake exhibitsignificantly enhanced conductivity. As discussed below, without beingbound by theory, it is believed that, in selected concentrations, forexample, greater than about 35 wt. %, the silver flake adopts asubstantially interconnected, lamellar configuration throughout thecomposition. This lamellar configuration provides the surfacing filmwith a substantially uniform continuous conductive path and relativelyhigh conductivity/low resistivity. For example, surfacing films havingresistivity values on the order of about 10 to 50 mΩ/sq in plane may beachieved. The resistivity of these surfacing films may be furtherlowered to values on the order of about 0.2 to 15 mΩ/sq by the additionof other conductive additives, such as silver nanowires. Notably, theseresistivities are comparable to metals such as aluminum (e.g., about 0.2mΩ/sq), indicating the feasibility of replacing heavy, screen-containingsurfacing films surfacing films formed from embodiments of theconductive compositions disclosed herein.

Embodiments of the conductive composition may also be tailored to meetthe requirements of various applications by adjusting the type and/oramount of the conductive additives. For example, electrostatic discharge(ESD) protection may be enhanced if the conductive additives areprovided in a concentration sufficient to provide the composition with asurface resistivity within the range of approximately 1 Ω/sq to 1×10⁸Ω/sq. In another example, electromagnetic interference (EMI) shieldingprotection may be enhanced if the conductive additives are provided in aconcentration sufficient to provide the composition with a surfaceresistivity within the range of approximately 1×10⁻⁶ to 1×10⁴ Ω/sq. In afurther example, lighting strike protection (LSP) may be enhanced if theconductive additives are provided in concentration sufficient to providethe composition with a surface resistivity within the range ofapproximately 1×10⁻⁶ to 1×10⁻³ Ω/sq.

In further embodiments, surfacing films may also be incorporated intocomposites. For example, surfacing films may be incorporated intocomposites by co-curing with prepregs, such as approximately 250° F. and350° F. curing prepregs, to provide composite structures having goodsurface finish and high conductivity. In alternative embodiments,surfacing films may be secondarily bonded with composites that havealready been cured at temperatures ranging between about 160° F. and350° F. Advantageously, this flexibility in manufacturing may allow thesurfacing films to be incorporated into composite structures during orafter composite fabrication. The cure temperature of embodiments of thesurfacing films may also be tailored for low temperatures,out-of-autoclave curing prepregs, within the range of about 140° F. and360° F. These and other advantages of the disclosed embodiments arediscussed in detail below.

FIG. 1 illustrates one embodiment of a method 100 of manufacturing acomposite which incorporates a surfacing film comprising an electricallyconductive, thermosetting polymer composition. The method 100 includesthe operations of adding one or more resins capable of forming athermosetting polymer to a mixing vessel in block 102, adding one ormore conductive additives to the mixing vessel in block 104, adding oneor more non-conductive fillers, flow control agents, chain extensionagents, and/or pigments to the mixing vessel in block 106, adding one ormore UV stabilizers to the mixing vessel in block 110, adding one ormore curing agents and/or catalysts for the resins to the mixing vesselin block 112, and straining and de-airing the composition in block 114.The method 100 may further comprise forming the composition into one ofa surfacing film in block 116 or adhesive in block 120. The method 100may further comprise incorporating the surfacing film into a compositein block 122.

As discussed in detail below, in the method 100, the components of thecomposition may be added to a mixing vessel equipped for mixing,heating, and/or cooling the components. Furthermore, as necessary, oneor more solvents may also be added to the mixture to promote mixing ofthe components. Examples of such solvents may include, but are notlimited to, methyl ethyl ketone (MEK), acetone, dimethylacetamide(DMAc), and N-Methylpyrrolidone (NMP). It may be understood that themethod 100 may include greater or fewer steps and that the steps of themethod 100 may be performed in any order, as necessary.

As illustrated in FIG. 1, the thermosetting resins are added to themixing vessel in block 102. Embodiments of the thermosetting resins mayinclude, but are not limited to, resins such as those discussed above.In preferred embodiments, the thermosetting resins may include one ormore of epoxies, bismaleimides (BMI), cyanate esters, phenolics,benzoxazines, and polyamides. In other embodiments, the thermosettingresin may include diglycidylether of bisphenol A, diglycidylether ofterabromo bisphenol A, and teratglycidylether methylenedianiline,4-glycidyloxy-N,N′-diglycidyaniline, and combinations thereof. Thethermosetting resins may further include chain extension agents andtougheners. In an embodiment, the thermosetting resins may be present ina concentration ranging between about 5 to 95 wt. %, on the basis of thetotal weight of the composition. In other embodiments, the thermosettingresins may be present in a concentration ranging between about 20 to 70wt. %,

Additional thermosetting resins may also be added to the mixing vesselto adjust the tack and drape of the composition. Embodiments of suchresins may include, but are not limited to, multi-functional epoxyresins. Examples of di-, and multi-functional epoxy resins may include,but are not limited to, commercially available resins such as those soldunder trade names MY 0510, MY 9655, Tactix 721, Epalloy 5000, MX 120, MX156. The additional epoxy resins may be present in an amount rangingbetween about 0 to 20 wt. %, on the basis of the total weight of thecomposition.

After addition of the thermosetting resins or polymers to the mixingvessel, the mixture may be allowed to mix using a high speed shearmixer. Mixing may be performed until the thermosetting resins are mixedsubstantially uniformly. For example, in one embodiment, mixing may beperformed for about 50 to 70 minutes at a speed of about 1000 to 5000rpm.

In other embodiments, toughening agents may also be added to thecomposition in block 102 to adjust the film rigidity and surfacehardness of the surfacing film. In certain embodiments, the tougheningagents may be polymeric or oligomeric in character, have glasstransition temperatures below 20° C. (more preferably below 0° C. orbelow −30° C. or below −50° C.), and/or have functional groups such asepoxy groups, carboxylic acid groups, amino groups and/or hydroxylgroups capable of reacting with the other components of the compositionsof the present invention when the composition is cured by heating. Incertain embodiment, the toughening agents may comprise elastomerictoughening agents. In other embodiments, the toughening agents maycomprise core-shell rubber particles or liquid rubbers. Examples oftoughening agents may be found in U.S. Pat. No. 4,980,234, U.S. PatentApplication Publication No. 2008/0188609, and International PatentPublication No. WO/2008/087467, the entirety of which is herebyincorporated by reference. The concentration of the toughening agentsmay range between about 5 to 40 wt. % on the basis of the total weightof the composition. The concentration of the toughening agent mayfurther range between about 1 to 30 wt. %.

Further examples of elastomeric toughening agents may include, but arenot limited to, carboxylated nitriles (e.g., Nipol 1472, Zeon Chemical),carboxyl-terminated butadiene acrylonitrile (CTBN), carboxyl-terminatedpolybutadiene (CTB), polyether sulfone (e.g., KM 180 PES—Cytec), PEEK,PEKK thermoplastic, and core/shell rubber particles (e.g. Kaneka's MX120, MX 156 and other MX resins with pre-dispersed core/shell rubbernanoparticles).

In block 104, conductive additives may be added to the mixing vessel.Embodiments of the conductive additives may include, but are not limitedto, metals and metal alloys, metal-coated particles, surfacefunctionalized metals, conductive veils, non-metals, polymers, andnano-scale materials. The morphology of the conductive additives mayinclude one or more of flakes, powders, particles, fibers, and the like.In an embodiment, the total concentration of all conductive additivesmay range between about 0.1 to 80 wt. %, on the basis of the totalweight of the composition. In alternative embodiments, the concentrationof all conductive additives may range between about 0.5 to 70 wt. %.

Metals and their alloys may be employed as effective conductiveadditives, owing to their relatively high electrical conductivity.Examples of metals and alloys for use with embodiments of the presentdisclosure may include, but are not limited to, silver, gold, nickel,copper, aluminum, and alloys and mixtures thereof. In certainembodiments, the morphology of the conductive metal additives mayinclude one or more of flakes, powders, fibers, wires, microspheres, andnanospheres, singly or in combination.

In certain embodiments, precious metals, such as gold and silver, may beemployed due to their stability (e.g., resistance to oxidation) andeffectiveness. In other embodiments, silver may be employed over gold,owing to its lower cost. It may be understood, however, that in systemswhere silver migration may be problematic, gold may be alternativelyemployed. Beneficially, as discussed below, it is possible for silverand gold filled epoxies to achieve resistivities less than about 20mΩ/sq.

In other embodiments, the conductive additives may comprise metal coatedparticles. Examples of metal-coated particles may include metal coatedglass balloons, metal coated graphite, and metal coated fibers. Examplesof metals which may be used as substrates or coatings may include, butare not limited to, silver, gold, nickel, copper, aluminum, and mixturesthereof.

In further embodiments, the conductive additives may comprise conductiveveils. Examples of such conductive veils may include, but are notlimited to, non-woven veils coated with metals, metal screens/foils,carbon mat, or metal coated carbon mat. Examples of metals which may beused as may include, but are not limited to, silver, gold, nickel,copper, aluminum, and mixtures thereof.

Embodiments of non-metals suitable for use as conductive additives withembodiments of the present disclosure may include, but are not limitedto, conductive carbon black, graphite, antimony oxide, carbon fiber.

Embodiments of nanomaterials suitable for use as conductive additiveswith embodiments of the present disclosure may include carbon nanotubes,carbon nanofibers, metal coated carbon nanofibers, metal nanowires,metal nanoparticles, graphite (e.g., graphite nanoplatelets), andnanostrands. In certain embodiments, largest mean dimension of thenanomaterials may be less than 100 nm.

Carbon nanotubes may include single-walled carbon nanotubes (SWNTs),double-walled carbon nanotubes (DNTs), and multi-walled carbon nanotubes(MWNTs). The carbon nanotubes, optionally, may also be surfacefunctionalized. Examples of functional groups that may be employed forfunctionalization of carbon nanotubes may include, but are not limitedto, hydroxy, epoxy, and amine functional groups. Further examples offunctionalized carbon nanotubes may include, Nano-In-Resin fromNanoledge, a CNT/epoxy concentrate with CNTs pre-dispersed in an epoxymatrix.

Examples of carbon nanofibers suitable for use as conductive additiveswith embodiments of the present disclosure may include bare carbonnanofibers (CNF), metal coated CNF, and NanoBlack II (ColumbianChemical, Inc.). Metal coatings may include, but are not limited to,Copper, aluminum, silver, nickel, iron, and alloys thereof.

Examples of nanowires suitable for use as conductive additives withembodiments of the present disclosure may include, but are not limitedto, nickel, iron, silver, copper, aluminum and alloys thereof. Thelength of the nanowires may be greater than about 1 μm, greater thanabout 5 μm, greater than about 10 μm, and about 10 to 25 nm. Thediameter of the nanowires may be greater than about 10 nm, greater thanabout 40 nm, greater than about 70 nm, greater than about 150 nm,greater than about 300 nm, greater than about 500 nm, greater than about700 nm, and greater than about 900 nm. Examples of silver nanowires mayinclude SNW-A60, SNW-A90, SNW-A300, and SNW-A900 from Filigree Nanotech,Inc.

In a preferred embodiment, the conductive additive may comprise silverflakes. As discussed in detail below, it has been identified that theuse of silver flake, and in particular, silver flake in combination withsilver nanowire, significantly enhances the electrical conductivity ofthermosetting compositions to levels that are approximately equal to orgreater than that of metals. Furthermore, silver flakes may be combinedwith other conductive additives as discussed herein to further enhancethe conductivity of the thermosetting composition. Examples include, butare not limited to, nanowires (e.g., silver nanowire), carbon nanotubes,metal coated glass balloons (e.g., silver-coated glass balloons).

For example, the embodiments of the composition including silver flakemay range in resistivity from as low as about 0.2 mΩ/sq at about 63 wt.% loading on the basis of the total weight of the composition (withadditions of about 3 wt. % silver nano wires) to greater than about 4500mΩ/sq at about 18 wt. % with silver flake alone. The ability to tailorthe resistivity of the composition within such a broad range issignificant, as the loading fraction of conductive additives within thecomposition may be adjusted for any of ESD, EMI, and LSP applications.

FIGS. 4A-4B present SEM micrographs examining polished cross-section andfracture surfaces of surfacing films containing embodiments of surfacingfilms comprising silver flakes (light regions, FIG. 4A) in an epoxymatrix. It may be observed from examination of FIG. 4A that the silverflakes are generally elongate in cross-section, with a high aspect ratioand are substantially uniformly distributed throughout the composition.The silver flakes are furthermore in contact with each other, forming asubstantially continuous network. This inter-connected lamellar-likestructure was confirmed by examination of surfacing film fracturesurfaces (FIG. 4B). This representative micrograph shows silver flakespresent at, or protruding outward from, the fracture surfacesubstantially throughout the fracture surface.

In certain embodiments, discussed in detail below in the examples, thislamellar-like morphology may be achieved with silver flake having a meansize of about 3 μm to 36 μm in concentrations greater than about 30 wt.%, for example, about 39 to 65 wt. %. Without being bound by theory,this conductive path is believed to be responsible for the substantiallyuniform, high conductivity achieved in these conductive surfacing films.The large flake size, up to about 30 μm, and relative large surface areaof silver flake provide sufficient surface area contact for continuous,good electrical conductivity throughout the composition in both X-Y andZ directions.

Both the lamellar configuration of the silver flake, and the exceedinglygood electrical conductivity were unexpected. The metal-likeconductivity assures the good performance of the conductivethermosetting composition for use in applications such as surfacingfilms for lightning strike protection, as discussed in the examplesbelow.

In block 106, non-conductive fillers may be added to the mixing vessel.In certain embodiments, the largest dimension of the fillers may rangebetween about 12 to 150 μm. The fillers may be further present in anamount ranging between about 0 to 40 wt. % on the basis of the totalweight of the composition. In other embodiments, the fillers may bepresent in a concentration ranging between about 5 to 30 wt. %.

Examples of non-conductive fillers may include ground or precipitatedchalks, quartz powder, alumina, dolomite, carbon fibers, glass fibers,polymeric fibers, titanium dioxide, fused silica, carbon black, calciumoxide, calcium magnesium carbonates, barite and, especially,silicate-like fillers of the aluminum magnesium calcium silicate type.Further discussion of fillers may be found in U.S. Pat. No. 4,980,234.

In other embodiments, the non-conducting fillers may include, but arenot limited to, ceramic microspheres (e.g., Zeeosheres—3M), glassballoons (e.g., iM30K, A16, H20—3M Corp.; SID-230Z-S2—Emersion &Cummings), and fumed silica. The fillers may be solid and provided inthe form of flakes, powders, fibers, microsphere, or glass balloons, andmay be solid or hollow structures, as necessary. In one embodiment, thefillers may include ZEESPHERES 200™, hollow, thick walled spheres of asilica-alumina ceramic composition.

Chain extension agents may also be added to the composition to increasethe molecular weight of the composition. The concentration of the chainextension agents may range between about 1 to 30 wt. % on the basis ofthe total weight of the composition. Examples of chain extension agentsmay include bisphenol A, tetrabromo bisphenol A (TBBA), bisphenol Z,tetramethyl bisphenol A (TMBP-A), and other bisphenol fluorines, asdiscussed in U.S. Pat. No. 4,983,672.

Pigments may be added to the composition for adjusting the color andappearance of the surfacing film. In an embodiment, pigments may includetitanium dioxide, carbon black, black pigment, and other color dyes. Thepigments may be provided in the form of flakes, powders, fibers, colorconcentrate liquid. The total amount of all pigments may range betweenabout 0 to 20 wt. % on the basis of the total weight of the composition.

Flow control agents may also be added to the mixing vessel in block 106.The flow control agents may be employed to modify the rheologicalproperties of the composition. Embodiments of the flow control agentsmay include, but are not limited to, fumed silica, microspheres, andmetallic powders. The flow control agents may be provided in the form offlakes, powders, fibers, spheres, or pellets. The largest dimension ofthe flow control agents may range between about 0.5 to 10 μm. The flowcontrol agents may be present in an amount ranging between about 0 to 40wt. %, more preferably, about 0.1 to 10 wt. %, on the basis of the totalweight of the composition.

After addition of the conductive additives, as well as any of fillers,pigments, chain extension agents and/or flow control agents to themixing vessel, the mixture may be allowed to mix in order tosubstantially distribute these components within the composition. Incertain embodiments, mixing may be performed for about 60 to 120 minutesat a speed of about 500 to 5000 rpm. During the mixing process, thetemperature of the composition may also be held to less than about 160°F. or below the temperature at which undesirable chemical reactions mayoccur.

In block 110, UV stabilizers may be optionally added to the mixture.Embodiments of the UV stabilizers may include UV absorbers,antioxidants, pigments, blocking agents, and fillers. Examples of the UVstabilizers may include, but are not limited to, butylatedhydroxytoluene (BHT), 2-hydroxy-4-methoxy-benzophenone (UV-9),2,4-Bis(2,4-dimethylphenyl)-6-(2-hydroxy-4-octyloxyphenyl)-1,3,5-triazine(CYASORB® UV-1164 light absorber), 3,5-Di-tert-butyl-4-hydroxybenzoicacid, n-hexadecyl ester (CYASORB® UV-2908 light stabilizer), titaniumdioxide, and carbon black. The UV stabilizers may be provided in theform of solid or liquid. In an embodiment, the UV stabilizers may eachbe present in an amount ranging between about 0.1 to 5 wt. %, on thebasis of the total weight of the composition. In other embodiments, theUV stabilizers may each be present in an amount ranging between about0.5 to 3 wt. %, on the basis of the total weight of the composition.

After addition of the UV stabilizers modifiers to the mixing vessel, themixture may be allowed to mix for about 30 to 60 minutes at a speed ofabout 500 to 2000 rpm. The temperature of the composition may also beheld to less than about 160° F.

In block 112, curing agents and, optionally, catalysts may be added tothe mixture. In certain embodiments, the curing agents may enable curingof the epoxies of the composition within a temperature range of about250° F. to 350° F. One or more curing agents may be present in an amountranging between about 0.1 to 40 wt. %, preferably, about 0.5 to 10 wt.%, on the basis of the total weight of the composition.

Examples of curing agents and catalysts may include, but are not limitedto, aliphatic and aromatic primary amines, aliphatic and aromatictertiary amines, boron trifluoride complexes, guanidines, anddicyandiamide. Additional examples of curing agents and catalysts may befound in U.S. Pat. No. 4,980,234 and U.S. Patent Application PublicationNo. 2008/0188609.

Further examples of amine curing agents and catalysts may include, butare not limited to, dicyandiamide, Bisureas (e.g., 2,4-Toluenebis-(dimethyl urea), [Omicure U-24 or CA 150], 4,4′-Methylenebis-(phenyl dimethylurea), [Omicure U-52, or CA 152] sold by CVCChemicals)), and 4,4′-diaminodiphenyl sulfone (4,4-DDS), and BF₃.

In certain embodiments, the temperature of composition may be maintainedbelow a selected value during addition of the curing agents andcatalysts in order to inhibit resin advancement by premature initiationof catalyst decomposition and reaction with the resin. The selectedlevel may range between about 75 to 150° F., for example, below about130° F. In other embodiments, shear mixing is performed at a rateranging between about 500 to 2000 rpm.

Table 1 presents selected embodiments of conductive polymercompositions, as discussed above, for use as surfacing films andadhesives.

TABLE 1 Embodiments of conductive surfacing film and adhesivecompositions Concentration (parts) Component 1 2 3 4 5 6 7 Epoxy ResinsDiglycidylether of Bisphenol A  5-15%  5-15%  5-50% 5-50%  5-50%  5-30%(e.g., DER 331, Epon 828) Tetraglycidylether methylenedianiline  1-5%2-10%  5-15% (e.g., MY 9655, 9634, 721) Diglycidylether of TetrabromoBis A  5-15%  5-15%  5-15% (e.g., DER 542) MY 0510, MX 120, Epalloy 50005-15% 10-60%  Toughening Agent Nipol 1472 elastomer 0.5-5% 0.5-5% 0.5-5%0.5-5% CTBN or CTB elastomer 0.5-5% 0.5-5% 0.5-5% 0.5-5% KM 180 PESpolymer 0.5-5% 0.5-5%  0.5-8% Chain extension agents Bisphenol A 0.5-5%0.5-5% 0.5-5% Tetrabromo Bisphenol A (TBBA) Bisphenol Z TetramethylBisphenol A (TMBP-A) Curing agents Bisureas (CA 150 or CA 152) 0.5-3%0.5-3% 0.5-3% 0.5-3% 0.5-3% BF₃ 0.5-1% Dicy 0.5-5% 0.5-5% 0.5-5% 0.5-5%0.5-5% 4,4-DDS 5-30%  5-30% Fillers Ceramic microsphere (e.g.  5-15% 5-15%  5-15% 5-15%  5-15%  5-15%  5-15% Zeeospheres) Flow controlagents Fumed silica 0.5-5% 0.5-5% 0.5-5% 0.5-5%  0.5-5% 0.5-5% 0.5-5% UVstabilizers additives Butylated Hydroxytoluene (BHT) 0.5-3% 0.5-3%0.5-3% 0.5-3%  0.5-3% 0.5-3% 0.5-3% 2-hydroxy-4-methoxy-benzophenone0.5-3% 0.5-3% 0.5-3% 0.5-3%  0.5-3% 0.5-3% 0.5-3% (UV-9) ConductiveFillers (various types) Concentration Range 1 35-70%  35-70%  35-70% 35-70%  35-70%  35-70%  35-70%  Concentration Range 2 15-65%  15-65% 15-65%  15-65%  15-65%  15-65%  15-65%  Concentration Range 3  1-20% 1-20%  1-20% 1-20%  1-20%  1-20%  1-20%

In block 114, the composition may be readied for use. In one embodiment,the composition may be strained so as to filter out any impurities andoutsized particulates within the composition. In certain embodiments,the composition may be filtered through a mesh having selected aperturedimension so as to remove foreign debris and outsized particulates fromthe composition.

In further embodiments, the composition may be de-aired under vacuum inorder to substantially removing air bubbles that may be incorporatedwithin the bulk of the composition. In an embodiment, a vacuum of about26 to 30 inches of mercury may be exerted on the composition. It may beunderstood that a selected portion of the volatile content of thecomposition may also be removed during the de-airing process. In certainembodiments, de-airing may be performed such that the de-airedcomposition has a solid content of about 55 to 100 wt. %, on the basisof the total volume of the composition.

The prepared composition may be subsequently employed for a variety ofapplications. Non-limiting examples may include surfacing films (block116), composites incorporating surfacing films (block 120), andadhesives (block 122).

In block 114, the composition may subsequently be formed into asurfacing film. In certain embodiments, the composition may be coated asa film using a hot-melt coating or solvated film coating processes. Theresulting film may have a film weight ranging between about 0.01 to 0.15psf, for example, about 0.035 psf.

Embodiments of the surfacing film may be further applied to a supportingstructure, such as a carrier to facilitate handling of the surfacingfilm. Examples of supporting structures may include metallic screens orfoils, non-woven mats, random mats, knit carriers, metal coated carbonveils, and the like. The geometry of the supporting structure may bevaried, as necessary. For example, the thickness of the carriers mayrange between about 0.5 to 5 mil. Other parameters regarding thecarriers, such as number of openings per unit area, strand width, andpatterning may also be varied, as necessary.

Examples of metallic screens or foils may include expanded metallicscreens or foils, and metal coated veils. Such screens and foils maycomprise copper, aluminum, silver, nickel, and alloys thereof.

Examples of non-woven mat carriers may include carbon mats, polymermats, and metal coated carbon, glass, or polymer glass veils. Thenon-woven mat carriers may be coated with copper, aluminum, silver,nickel, and alloys, and alloys thereof.

The film so formed may then be dried to remove volatiles. In certainembodiments, the volatile content of the film may range between about0.1 to 0.99 wt. %, on the basis of the total weight of the film. Forexample, the volatile content of the surfacing film after drying may beless than about 1 wt. %.

The surfacing film so formed may also be stored until needed. Forexample, the surfacing film may be stored in cold storage in order toinhibit curing of the surfacing film, prolonging its useful shelf life.Backing films or papers may be applied to one or more surfaces of thesurfacing film in order to inhibit the surfacing film from inadvertentattachment to surfaces prior to intended use.

The surfacing films may be further integrated within a compositestructure in block 116. This process is discussed below in greaterdetail with respect to FIGS. 2 and 3. FIG. 2 illustrates one embodimentof a method 200 of forming a composite including an embodiment of asurfacing film of the present disclosure. A corresponding schematicillustration of the composite is illustrated in FIG. 3.

In block 202, a mold or tool 314 (FIG. 3) may be prepared to receive thesurfacing film 310 and a composite prepreg layup 304. The mold 314 maybe configured with a selected shape and may further comprise texturingand/or other surface and through thickness features, as necessary. Theprepreg layup 304 and/or surfacing film 310 may be placed in contactwith at least a portion of the mold 314 such that the composite may becured in the selected shape of the mold 314, as discussed below.Abrasives may be applied to the tool to remove surface debris and leavea substantially smooth surface. A mold release agent may be furtherapplied to the mold 314 to facilitate removal of the composite part fromthe mold 314 after processing is completed.

In block 204, the surfacing film 310 is applied to the mold 314. Thesurfacing film 310 may be removed from cold storage and allowed to warmto approximately room temperature. The surfacing film 310 is then cut todesired shape and the backing film on the resin-rich side of thesurfacing film 310 is removed. The exposed film is subsequently appliedto the cleaned surface of the mold 314, with care taken thatsubstantially no wrinkles or air bubbles are present in the surfacingfilm 310. Application of the surfacing film 310 in this manner may beaccomplished by manual or automated mechanisms (e.g., automatic tapelayup (ATL), automatic fiber placement (AFP)).

In block 206, the prepreg layup 304 may be co-cured with the surfacingfilm in order to incorporate the surfacing film 310 with the composite.In an embodiment, one or more prepreg layers may be assembled in aprepreg layup 304 that is placed adjacent the surfacing film 310. Inalternative embodiments, the prepreg layup 304 may be assembled andsubsequently placed adjacent the surfacing film 310. The prepregs maytake the form of woven fabrics or tapes, as desired.

Optionally, one or more cores 320 may be interposed between layers ofthe prepreg layup 304 The cores may comprise foamed structures,honeycombed structures, and the like. An adhesive film 326 may befurther interposed between the prepreg layup 304 and the core 320 inorder to facilitate bonding of the core 320 to the prepreg layup 304.

An FEP film 330 may be further placed adjacent the surface of theprepreg layup 304 opposite the surfacing film 310. The FEP film 330provides isolation and part release.

A breather mat 332 may be also placed adjacent the surface of the FEPfilm 330. The breather mat 332 acts to absorb at least a portion ofexcess resin from the prepreg layup 304. Although not shown, breathercloths, as known in the art, may also be added to the assembledstructure.

The assembly 308 formed in this manner may be enclosed within a baggingmaterial capable of supporting an applied vacuum and placed within anenclosure 300 for use in curing and/or consolidating prepreg layups withembodiments of the surfacing film 310. In certain embodiments, theenclosure 300 may be configured to provide heat 308, pressure 302,vacuum 316, and combinations thereof, such as ovens and autoclaves.

In embodiments where the assembly 308 is heated, the enclosure 300 maybe heated to a temperature which ranges between about 180 to 350° F.,preferably, about 250 to 350° F., depending upon the intended curetemperature of the prepreg resin used. In certain embodiments, theheating rate may range between about 1 to 5° F./min.

In further embodiments, the enclosure 300 may be capable of applying avacuum to the assembly 308. For example, the bagging material 312 mayform an approximately gas-tight region in communication with a vacuumsource of the enclosure 300. The level of vacuum applied by theenclosure 300 may be varied or kept constant during curing and/orconsolidation. For example, a vacuum ranging between about 40 to 50 psior less may be applied to the assembly 308.

In further embodiments, the enclosure 300 may be capable of applying apressure 302 on the assembly 308. The applied pressure 302 may beprovided by a pressure source in communication with the enclosure 300.The applied pressure 302 may further be varied or kept constant duringcuring and/or consolidation. For example, a pressure ranging about 14 to100 psi may be applied, depending upon the part design and structuralintegrity.

In block 210, finishing operations may be performed upon the surfacingfilm. In one example, a fine abrasive (e.g., about 240 to 320 grit) maybe applied to the surfacing film in order to substantially remove anydebris on the surface of the surfacing film 310 (e.g., mold releaseagent) and provide a selected degree of roughness or polish to thesurface of the surfacing film 310. The surfaced composite structure maybe overcoated with paint primer and topcoat enamel.

EXAMPLES

In the examples below, surfacing films formed from embodiments of theconductive thermosetting compositions of the present disclosure arediscussed in detail. In particular, the conductivity and/or resistivityof surfacing films having various conductive additives, and the lightingstrike protection performance they provide, are investigated andcompared with that afforded by other systems. Notably, it is discoveredthat compositions containing silver flake, alone or in combination withother conductive additives, exhibit very low resistivity values,comparable to metals. These examples are discussed for illustrativepurposes and should not be construed to limit the scope of the disclosedembodiments.

Example 1 Surfacing Film Preparation

Thermosetting conductive compositions for use in surfacing films wereprepared from the components listed in Table 2 below. The compositionseach comprised epoxy resins, elastomeric tougheners, non-conductiveadditives, flow control agents, UV stabilizers, solvents, and conductiveadditives. Each of trials 1-6 investigated the effect of a conductiveadditive upon the resistivity of the surfacing film.

TABLE 2 Surfacing Film Compositions Concentration (wt. %) ComponentTrial 1 Trial 2 Trial 3 Trial 4 Trial 5 Trial 6 Trial 7 Trial 8 EpoxyResins Diglycidylether of 12%  12%  12%  12%  12%  12%  12%  12% Bisphenol A (DER 331, Epon 828) Tetraglycidylether 2% 2% 2% 2% 2% 2% 2%2% methylenedianiline (MY 9655, 9634, 721) Diglycidylether of 8% 8% 8%8% 8% 8% 8% 8% Tetrabromo Bisphenol A (DER 542) Toughening Agent Nipol1472 elastomer 1.5%  1.5%  1.5%  1.5%  1.5%  1.5%  1.5%  1.5%  CTBN orCTB elastomer 1.5%  1.5%  1.5%  1.5%  1.5%  1.5%  1.5%  1.5%  Curingagents Bisureas 1% 1% 1% 1% 1% 1% 1% 1% (CA 150 or CA 152) Dicy 1% 1% 1%1% 1% 1% 1% 1% Fillers Ceramic microsphere 9% 9% 9% 9% 9% 9% 9% 9% (e.g.Zeeospheres) Flow Control Fumed silica 1.50%   1.50%   1.50%   1.50%  1.50%   1.50%   1.50%   1.50%   UV stabilizers additives Butylated 1% 1%1% 1% 1% 1% 1% 1% Hydroxytoluene (BHT) 2-hydroxy-4-methoxy- 1% 1% 1% 1%1% 1% 1% 1% benzophenone (UV-9) Conductive Fillers Silver Flake (AB0022) 56%  Silver Flake (EA 0295) 56%  Silver-Coated Copper 56%  (50%Ag) Silver-Coated Aluminum 56%  (Conduct-O-Fil) Nickel-Coated Graphite56%  Silver-Coated Nickel 56%  Carbon Black 2.5-7.5%    Carbon Nanofiber4-16%    Surface Resistivity (mΩ) 12.5 152 4950 4500 3100 6100 17,000-20,000- 47,000 200000

Conductive surfacing films were prepared by addition of the componentsoutlined above to a mixing vessel and mixing the components using ahigh-speed shear lab mixer. About 100 parts by weight of the epoxyresin, including an approximately 60:40:10 ratio of Diglycidylether ofBisphenol A (DER 331—Dow Chemical) to Tetraglycidylethermethylenedianiline (MY9655—Huntsman) to Diglycidylether of TetrabromoBisphenol A (DER 542—Dow Chemical), was added to the mixing vessel andstirred for about 30 minutes at about 1000 rpm. MEK was added as asolvent with the epoxy resins to adjust the rheology and solid contentof the composition, as necessary.

Subsequently, about 1.5 wt. % of elastomer tougheners Nipol 1472 (ZeonChemical) and 1.5 wt. % of CTBN (or CTB) type elastomer (Hycar CTBN1300X13—Noveon) were added to the epoxy resins. Conductive fillers werealso added to the mixing vessel in a concentration of about 46-56 wt. %.About 10 wt. % ceramic microspheres (Zeeospheres G-200—3M.), about 2 wt.% of a flow control agent, amorphous fumed silica, and about 1% each ofUV stabilizers BHT and 2-hydroxy-4-methoxy-benzophenone were furtheradded to the mixing vessel. MEK solvent was added, as necessary, tocontrol the viscosity of above mix to about 80 wt. % solids and thecomponents of the composition were mixed for about 50-70 minutes atabout 1000-3000 rpm. The temperature of the composition was kept belowabout 160° F. Additional MEK was added, as necessary, to inhibit themixture from climbing the mixing shaft.

The mixture was subsequently cooled to below about 120° F. and about 1wt. % latent curing agents dicyandiamide (Dicy) and Bisurea (based ontoluenediamine (CA-150—Omicure U24) or CA 152—Omicure U-52—CVC Chemical)were each added to the composition. The composition was then mixed forabout 5-10 minutes until approximately homogenous. The temperature ofthe mixture, during addition of the curing agents, was maintained belowabout 130° F.

To form surfacing films from the above compositions, each compositionwas strained, de-aired, and deposited as a film. Straining was performedthrough filtration media EP-15. De-airing was performed such that thesolid content of the composition was about 80 wt. %. The strained andde-aired composition was then coated as a film having about 0.035 psffilm weight by a film coater and then dried to less than about 1% byweight volatiles. A selected non-woven polyester or glass random matcarrier was pressed into film under light pressure to embed the mat tothe film.

Composite parts incorporating the surfacing film were manufactured byincorporating the surfacing film onto a tool, followed by layup of aprepreg, according to the prepreg manufacturer's instructions. Thecomposite part was then cured at a temperature between about 180° F. and350° F., for about 60 to 180 minutes, e.g., about 90 to 120 minutes,depending upon the intended cure temperature of the prepreg system.During a cure under autoclave conditions, the composite parts wereexposed to a pressure of about 14 to 100 psi, for about 60 to 180minutes, depending upon the part design and structural density.

Example 2 Electrical Conductivity Measurements of Surfacing FilmsComprising Varied Conductive Additive

Cured surfacing films having 2 plies were cut to test coupons of about6×5 inches and electrical conductivity or surface resistivity (inOhm/square, or milliohm/square) was measured using a four-point probeAVO® Ducter® DLRO10X Digital Low Resistivity Ohmmeter. Surfaceresistivity was measured in accordance with the BMS10-21K specification(Boeing), with an approximately 4 inch distance between the probes.

Trial 1—Electrical Conductivity Measurements of Surfacing FilmsComprising Silver Flake as Conductive Additive

Silver flake (e.g. AB 0022 from Metalor Technologies, was employed asthe conductive additive in the composition of trial 1. The particle sizedistribution of the AB 0022 silver flake is: about 13.4 μm (D₅₀), about28.5 (D₉₀), and about 64.5 (D₁₀₀). The conductive surfacing filmprepared from the composition was found to exhibit a resistivity ofabout 12.5 mΩ/sq.

Trial 2—Electrical Conductivity Measurements of Surfacing FilmsComprising Silver Flake as Conductive Additive

Silver flake (e.g. EA 0295—Metalor Technologies) was employed as theconductive additive in the composition of trial 2. The particle sizedistribution of the EA 0295 silver flake is: about 5.2 μm (D₅₀), about13.34 (D₉₀), and about 32.5 (D₁₀₀), which is about half the size of theAB 0022 silver flake. The conductive surfacing film prepared from thecomposition was found to exhibit a resistivity of about 152 mΩ/sq.

Trial 3—Electrical Conductivity Measurements of Surfacing FilmsComprising Silver-Coated Copper as Conductive Additive

Silver-coated copper (Ferro) was employed as the conductive additive inthe composition of trial 3. The silver-coated copper particles had amean diameter of about 45 μm. The conductive surfacing film preparedfrom the composition was found to exhibit a resistivity of about 125 to137 mΩ/sq.

Trial 4—Electrical Conductivity Measurements of Surfacing FilmsComprising Silver-Coated Aluminum as Conductive Additive

Silver-coated aluminum (AEE, Micron Metals, Inc.) was employed as theconductive additive in the composition of trial 4. The conductivesurfacing film prepared from the composition was found to exhibit aresistivity of 4500 mΩ/sq.

Trial 5—Electrical Conductivity Measurements of Surfacing FilmsComprising Nickel-Coated Graphite as Conductive Additive

Nickel-coated graphite (AEE, Micron Metals, Inc.) was employed as theconductive additive in the composition of trial 5. The conductivesurfacing film prepared from the composition was found to exhibit aresistivity of 3100 mΩ/sq.

Trial 6—Electrical Conductivity Measurements of Surfacing FilmsComprising Silver-Coated Nickel as Conductive Additive

Silver-coated nickel (AEE, Micron Metals, Inc.) was employed as theconductive additive in the composition of trial 6. The conductivesurfacing film prepared from the composition was found to exhibitresistivity of less than about 6100 mΩ/sq.

Trial 7—Electrical Conductivity Measurements of Surfacing FilmsComprising Carbon Black as Conductive Additive

Conductive carbon black (Printex XE2—Degussa) was employed as theconductive additive in the composition of trial 7. Loading levelsranging from about 2.5 to 7.5 wt. % were examined. As illustrated inFIG. 5B, the conductive surfacing film prepared from the composition wasfound to exhibit resistivity between about 17,000 to 47,000 Ω/sq.

Trial 8—Electrical Conductivity Measurements of Surfacing FilmsComprising Carbon Nanofibers as Conductive Additive

Carbon nanofibers were employed as the conductive additive in thecomposition of trial 7. Loading levels ranging from about 4 to 16 wt. %were examined. As illustrated in FIG. 5B, the conductive surfacing filmprepared from the composition was found to exhibit resistivity betweenabout 20,000 to 200,000 Ω/sq.

Summary of Screening Study

The resistivity measurements for each composition are summarized in FIG.6. Notably, compositions including silver flake additives (e.g., trials1 and 2) exhibited very low resistivity values, for the same level ofconductive additive loading, as compared with other conductive additives(e.g., trials 4-8). These low resistivity values are comparable to, orbetter than, that of surfacing films incorporating copper metal careens,about 15 mOhm/sq. These compositions may find utility in surfacing filmsemployed for lightning strike protection

Trials 7 and 8, employing carbon black and carbon nanofibers, exhibitedrelatively high resistivity values, as compared to trials 1-6. Theseadditives, while less suitable for surfacing films employed forlightning strike protection, may find utility in surfacing EMI shieldingand ESD applications.

Example 2 Effect of Silver Flake Type and Loading on ElectricalConductivity of Surfacing Films

As shown in Example 1, conductive additives comprising silver flakeswere found to provide embodiments of the surfacing film with very lowelectrical resistivity. In order to better understand the effect ofsilver flake on electrical properties, a systematic study of electricalconductivity as a function of loading for three different silver flaketypes (AB 0022 and EA 0295) and a silver-copper flake was performed. Thecompositions were otherwise as discussed above, The electricalconductivity results obtained are summarized in the following Table 3.

TABLE 3 Effect of Silver Flake Type and Loading on ElectricalConductivity of Surfacing Films LOADING ELECTRICAL SILVER FLAKE METALFLAKE LEVEL CONDUCTIVITY TYPE CHARACTERISTICS (WT. %) [SR; MILLI-OHM/SQ]Trial 9 Particle size (μm): 18% 4640 Silver Flake D₅ = 5.0, D₅₀ = 13.4,D₉₀ = 28.5 30% 4430 (AB 0022) Tap Density = 2.2 g/cm³; 39% 462 ApparentDensity = 1.5 g/cm³; 46% 53 Surface Area = 0.63 m²/g 56% 13 63% 10 Trial10 Particle size (μm): 56% 152 Silver Flake D₅ = 1.5, D₅₀ = 5.2, D₉₀ =13.3 μm 63% 27 (EA 0295) Tap Density = 4.3 g/cm³; Apparent Density = 2.4g/cm³; Surface Area = 0.53 m²/g

As shown in Table 3 and FIG. 6, resistivity of the surfacing filmdecreases significantly with increasing concentration of silver flake.For example, the resistivity of surfacing film compositions comprisingAB 0022 silver flake decreased from about 4640 mΩ at about 18 wt. %loading to about 12.5 mΩ at about 56 wt. % loading, to about 10 mΩ atabout 63 wt. % loading. Similarly, the resistivity of surfacing filmcompositions comprising EA 0295 silver flake decreased from about 152 to27 mΩ as the silver flake concentration increased from about 56 to 63wt. % loading.

Furthermore, at equivalent loading levels, the AB 0022 silver flake wasfound to exhibit lower conductivity values than those of EA 0295.Without being bound by theory, this observation may be explained by theparticle size distribution and the surface area difference of the twoflakes. The AB 0022 silver flake exhibits a larger particle sizedistribution than EA 0295, which may allow for greater packingefficiency, which facilitates contact between the silver flakes

It may also be observed that there is a pronounced decrease in theresistivity of the composition when the concentration of silver flake AB0022 exceeded about 40 wt. %. As discussed below, this result isbelieved to be due to the formation of a substantially continuous,interconnected, lamellar network of silver flakes. These results furthersuggest that, in certain embodiments, the concentration of silver flakewithin the composition may exceed about 40 wt. %. In other preferredembodiments, the concentration of silver flake may exceed about 46% soas to provide surfacing films having resistivity levels comparable tometals.

Example 4 Surfacing Film Microstructure Study Using SEM

The microstructure of composite surfacing films containing silver flake(AB 0022) was further examined to better understand the role of thesilver flake in the conductivity of the surfacing film. The compositeswere fabricated per Boeing BMS 8-341 specification for surfacing films.In order to examine the microstructure of the composite laminatesprepared in this manner, samples were cut into small size, about 10mm×20 mm, and mounted in an epoxicure resin system. The surface forexamination was polished in a sequence of diminished abrasive size,about 320 grit/about 1200 grit/about 0.3 μm alumina slurry/about 0.05 μmalumina slurry, using a Buehler Metasery 2000 grinder/polishing machine.For examination of the film microstructure, the surface was coated withplatinum and analyzed using a Hitachi S-2700 Scanning ElectronMicroscope (SEM), as illustrate in FIG. 4

SEM examination on those highly conductive surfacing films reveals theformation of a continuously inter-connected lamellar conductive pathstructure comprised of randomly dispersed fine silver flakes in theepoxy matrix (light regions, FIG. 4A). This conductive path is believedto be responsible for the substantially uniform, high conductivity ofthese conductive surfacing films. The large flake size, up to about 30μm, and relative large surface area of silver flake AB 0022 providesufficient surface area contact for continuous, good electricalconductivity throughout the matrix. In the matrix, the metal flakes packclosely to one another in a substantially parallel orientation,facilitating the passage of electrons.

Example 6 Surfacing Film Compositions Incorporating Silver Flakes andOther Conductive Additives

Due to the high conductivity measured in embodiments of the compositioncontaining silver flake, further conductivity studies were performed toexamine the performance of silver flake in combination with otherconductive additives for further conductivity enhancement of thesurfacing film composition. With the exception of the new conductiveadditives, these compositions were approximately unchanged from thosediscussed above with respect to Table 1. Table 4 summarizes theconductive additives containing silver flake and other conductiveadditives: silver flake alone (baseline), silver flake and silvernanowires, silver flake and carbon nanotubes, and silver flake andsilver-coated glass balloons.

TABLE 4 Silver flake containing surfacing film compositions OTHER SILVERSILVER ADDITIVE SURFACE FLAKE CONC. CONC. RESISTIVITY TYPE (WT. %) (WT.%) (MΩ/SQ) Trial 11 18% 4640 Silver Flake 30% 4430 (AB 0022) 39% 462 46%53 56% 13 63% 10 Trial 12 46% 3% 15 Silver Flake and 51% 3% 5 silvernanowires 56% 3% 0.2 (SF + SNW) Trial 13 51% 0.3%   50 Silver Flake and56% 0.7%   20 carbon nanotubes 56% 1.2%   15 (SF + CNT) Trial 14 51% 5%60 Silver Flake/and 56% 5% 20 silver-coated glass balloons (SF + B)

Trial 12—Electrical Conductivity Measurements of Surfacing FilmsComprising Silver Flake and Silver Nanowires (SNW) as ConductiveAdditives

Silver flake (AB 0022) and silver nanowires (SNW-A30, SNW-A60, SNW-A300,SNW-A900, —Filigree Nanotech, Inc.) were employed as the conductiveadditives in the composition of trial 9. The length and diameter of thesilver nanowires was about 1 to 25 μm and 30 to 900 nm, depending uponthe size and type of SNW selected. The concentration of silver nanowireswas further kept constant at about 3 wt.%, while the concentration ofsilver flake was varied between about 46 to 56 wt. %. It was observedthat the resistivity of the composition decreased significantly withincreasing silver flake content, from about 15 mΩ/sq at a concentrationof about 46 wt. % to about 0.2 mΩ/sq at a concentration of about 56 wt.%.

Trial 13—Electrical Conductivity Measurements of Surfacing FilmsComprising Silver Flake and Carbon Nanotubes as Conductive Additives

Silver flake (e.g., AB 0022) and carbon nanotubes (CNT/epoxy concentrateNP-W1M2, NP-A1M2, NP-A3M2, or NP-A2M2 from Nanoledge) were employed asthe conductive additives in the composition of trial 10. The length anddiameter of the CNTS varied, depending upon the CNT employed. Theconcentration silver flake and CNTs were each varied in trial 10, withthe CNT concentration varying between about 0.3 to 1.2 wt. %, while theconcentration of silver flake was varied between about 51 to 56 wt. %.It was observed that the resistivity of the composition decreased withincreasing silver flake content, from about 50 mΩ/sq at a concentrationof about 51 wt. % to about 15 mΩ/sq at a concentration of about 56 wt.%.

Trial 14—Electrical Conductivity Measurements of Surfacing FilmsComprising Silver Flake and Silver-Coated Glass Balloons as ConductiveAdditives

Silver flake (e.g., AB 0022) and silver-coated glass balloons (CNT/epoxyconcentrate NP-W1M2, NP-A1M2, NP-A3M2, or NP-A2M2 from Nanoledge) wereemployed as the conductive additives in the composition of trial 11. Theconcentration of silver-coated glass balloons was further kept constantat about 5 wt. %, while the concentration of silver flake was variedbetween about 51 to 56 wt. %. It was observed that the resistivity ofthe composition decreased with increasing silver flake content, fromabout 60 mΩ/sq at a concentration of about 51 wt. % to about 15 mΩ/sq ata concentration of about 20 wt. %.

Summary of Compositions Containing Silver Flake and Other ConductiveAdditives

The resistivity measurements for each composition are compared inagainst one another in FIG. 7. In one aspect, the silver flakecontaining compositions each exhibited decreasing resistivity withincreasing silver flake concentration. Further comparing the performanceof the compositions against one another, the compositions includingsilver flake and silver nanowires exhibited the best performance,followed by silver flake alone and silver flake and CNTs (1.2 wt. %loading) on the basis of lowest resistivity for a given silver flakeloading. Furthermore, the resistivity of the surfacing film compositionsdoes not exceed about 60 mΩ/sq, which is still comparable to that ofmetals.

Example 7 Lightning Strike Protection

The high, metal-like conductivity exhibited in embodiments of thesurfacing films disclosed herein, achieved without using metal screensor foils, make them suitable for use in lightning strike protection(LSP) applications. To evaluate the performance of these surfacing filmsfor LSP of composites, lightning strike testing was performed oncomposites incorporating surfacing films formed from conductivecompositions including silver flake (e.g., composition of trial 1) inloadings ranging between about 56-63 wt. %. The performance of thissystem for LSP was compared to that of a control including the samecomposite and a surfacing film comprising a metal screen embedded withina polymer composition,

Composite testing panels were fabricated with between 6 to 9 plies ofprepregs in a multi-angle layup, as discussed above, with the conductivesurfacing films as the outermost layer. The layups and surfacing filmswere then co-cured in an autoclave to incorporate the surfacing filmswithin the composites. The panels were further overcoated with a paintprimer and enamel top coat prior to lightning strike testing.

Lightning direct effect tests were employed to evaluate the performanceof composites used within different zones of aircraft. The lightningstrike tests are performed in accordance with RTCA/DO-160F,“Environmental Conditions and Test Procedures for Airborne Equipment” ofthe Radio Technical Commission for Aeronautics. In brief, a surfacingfilm/laminate panel is secured in place, and placed in electricalcontact with current return elements. An electrode is positioned atabout the center and adjacent the test panel. An initiating wire isextended from the electrode to the incipient lightning strike point onthe sample surface.

Tests were conducted to simulate a lightning strike upon Zone 1A of anaircraft, the radome, and Zone 2A of an aircraft, most of the fuselagesections. The tests simulate lighting strikes by subjecting the testpanels to high current test waveforms described below in Table 5. Asshown in Table 5, the applied waveform may include a number ofcomponents, which vary depending upon the section of the aircraft thepanel is intended to represent.

TABLE 5 Waveforms Employed in LSP Testing Peak Current Average ActionCharge Amplitude Current Integral Transfer Zone Waveform [kA] Amplitude[kA] [A²s] [C] Applied Component A 200 +/− 20 2 × 10⁶ +/− 1A 0.4 × 10⁶Component B 2 +/− 0.4 10 +/− 0.1 1A 2A Component C ≧0.4 18 +/− 3.6 1A 2AComponent D 100 +/− 10 0.25 × 10⁶ +/− 2A 0.05 × 10⁶For example, a test simulating a Zone 1A strike would employ a waveformincluding Components A, B, and C, while a test simulating a Zone 2Astrike would employ a waveform including Components B, C, and D

FIGS. 8A-8B illustrate unpainted composite panels incorporating thecontrol surfacing film embedded with copper screen and an embodiment ofa silver flake containing surfacing film of the present disclosure afterlighting strike testing simulating Zone 1A, respectively. FIGS. 9A-9Billustrate the Zone 1A performance of similar composite panels testedwhen painted prior to testing. FIGS. 10A-10B illustrate painted andunpainted composite panels incorporating an embodiment of a silver flakecontaining surfacing film of the present disclosure after lightingstrike testing simulating Zone 2A, respectively

In general, the silver flake containing surfacing film/compositelaminate panels exhibited comparable lighting strike protection toperformance of the control panel having a metal copper screen, with noevidence of punch through. Furthermore, surface damage was very limited.

The surface damage observed for the painted and unpainted test panelswas varied, ranging from mesh burns, speckling of surface anddelamination of surface layer, to broken fibers. For the same surfacingfilm/composite configuration, the painted panels generally exhibitedmore damage than the unpainted panels. This difference is due to thereduction in number of arc dispersion sites and concentration of strokein local areas in the painted panels.

These results indicate that embodiments of the silver flake containingsurfacing film/composite laminate panels possess significant lightingstrike protection functionality and passed the lighting direct effecttest in both zone 1A and 2A. Beneficially the surfacing film/compositelaminate panels show comparable LSP to a control panel with a metalscreen, affording comparable LSP with a weight savings of up to around50%.

Example 8 Adhesive Testing

Embodiments of the thermosetting conductive compositions were alsosubjected to testing to evaluate their performance in adhesiveapplications. The tests performed included wide area lap shear strengthtesting and floating roller peel strength testing.

Lap shear testing provides information regarding the shear strength ofan adhesive when the adherends bonded by the adhesive are loaded intension. Wide area lap shear testing was performed in accordance withASTM 3165, “Standard Test Method for Strength Properties of Adhesives inShear by Tension Loading of Single-Lap-Joint Laminated Assemblies” atabout room temperature, 180° F., and 250° F.

Floating roller peel testing provides information regarding the strengthof an adhesive when one adherend is flexible and peeled at approximatelyconstant angle from another adherend which is rigid. Floating rollerpeel testing was performed in accordance with ASTM D3167, “Standard TestMethod for Floating Roller Peel Resistance of Adhesives at about roomtemperature, 225° F., and 250° F.

The composition of Trial 1, employing silver flake in a concentration ofabout 42 wt. % was evaluated. The composition, as described above, wasmixed, de-aired, and subsequently coated as a hot melt film with about0.06 psf film weight. A non-woven, random mat carrier was pressed intothe film under light pressure to adhere the mat to the film. Conductivecompositions were combined with either non-woven carbon veil, oraluminum screen.

A control sample was prepared with the same composition in a similarmanner, with the exception that the conductive additive was omitted. Thecontrol sample further included the aluminum screen. The testing resultsfor each adhesive are illustrated below in Table 6.

TABLE 6 Adhesive performance of conductive compositions Trial 15 Trial16 Conductive Conductive Trial 17 Adhesive Adhesive Control adhesiveAdhesive Carrier 0.06 psf 0.06 psf 0.06 psf Carbon mat 0.016 Al screen0.016 Al screen Wide Area Lap 3074 3318 4375 Shear (psi, RT) Wide AreaLap 3286 3714 4813 Shear (psi, 180° F.) Wide Area Lap 3000 3078 4130Shear (psi, 250° F.) Floating Roller 26 26 23 Peel (pli, RT) FloatingRoller 26 26 Not tested Peel (pli, 225° F.) Floating Roller 27 27 Nottested Peel (pli, 250° F.) Resistivity (mΩ/sq) 250 250 High(non-conductive)

Trial 15—Adhesive Property Measurements of Adhesive Film ComprisingSilver Flake as Conductive Additive on Carbon Mat

Examining the results of Table 6, it may be observed that the adhesivestrength of the composition of trial 15, as measured by wide area lapshear and floating roller peel, is approximately constant over thetemperature ranges studied. In one example, over a temperature range ofmore than 200° F., from about room temperature to about 250° F., the lapshear strength only varies about 10%, between about 3000 and 3286 psi.Over approximately that same temperature, peel strength varies less than5%, between about 26 to 27 pli.

Trial 16—Adhesive Property Measurements of Adhesive Film ComprisingSilver Flake as Conductive Additive on Aluminum Screen

Examining the results of Table 6, it may be observed that the adhesivestrength of the composition of trial 16, as measured by wide area lapshear and floating roller peel, shows modest variation over thetemperature ranges studied. In one example, from about room temperatureto about 250° F., the lap shear strength varies about 20%, between about3078 to 3714 psi. Over approximately that same temperature, peelstrength varies less than about 5 pli.

Trial 17—Adhesive Property Measurements of Control Adhesive Film onAluminum Screen

Examining the Results of Table 6, it May be Observed that the Adhesivestrength of the composition of trial 17, as measured by wide area lapshear and floating roller peel, shows modest variation over thetemperature ranges studied. In one example, from about room temperatureto about 250° F., the lap shear strength varies about 20%, between about4130 to 4813 psi. Over approximately that same temperature, peelstrength varies.

Summary—Adhesive Testing

Comparing the results of Trials 12-14, the silver flake containingconductive adhesives of Trials 15-16 exhibited both good conductivity,about 250 mΩ/sq and good adhesive properties, as measured by lap shearstrength and peel strength. Notably, the adhesive properties arecomparable to that of the non-conductive control adhesive, indicatingthat conductivity may be achieved with the composition withoutsacrificing adhesive strength. These results further demonstrate thepotential suitability of the conductive adhesives for certain aerospaceEME applications, such as LS surface repair, as path for return current,or conductive fasteners to reduce capacitive potentials.

Although the foregoing description has shown, described, and pointed outthe fundamental novel features of the present teachings, it will beunderstood that various omissions, substitutions, changes, and/oradditions in the form of the detail of the apparatus as illustrated, aswell as the uses thereof, may be made by those skilled in the art,without departing from the scope of the present teachings. Consequently,the scope of the present teachings should not be limited to theforegoing discussion, but should be defined by the appended claims.

What is claimed is:
 1. A composite structure comprising an electricallyconductive surfacing film formed on a composite substrate, wherein thesurfacing film is capable of providing lightning strike protection andelectromagnetic interference shielding, has an electrical resistivity ofless than 500 mΩ/sq, a film weight in the range of 0.01-0.15 psf (poundsper square foot), and is formed from a curable thermosetting compositioncomprising: a. at least one multifunctional epoxy resin; b. at least onecuring agent selected from the group consisting of: aromatic primaryamines, bisureas, boron trifluoride complexes, and dicyandiamide; c. atleast one toughening agent having a functional group selected from epoxygroups, carboxylic acid groups, amino groups and hydroxyl groups capableof reacting with other components of the composition; d. non-conductivefillers; e. conductive additives in an amount greater than about 35 wt.%, based on the total weight of the composition.
 2. The compositestructure of claim 1, wherein the composite substrate is a prepreg layupcomprising a plurality of prepreg layers, each of said prepreg layerscomprising reinforcing fibers impregnated with a matrix resin.
 3. Thecomposite structure of claim 1, wherein said at least onemultifunctional epoxy resin comprises a combination of Diglycidyletherof Bisphenol A and at least one of Tetraglycidylether methylenedianilineand Diglycidylether of Tetrabromo Bisphenol A.
 4. The compositestructure of claim 1, wherein said at least one curing agent is selectedfrom the group consisting of: dicyandiamide, Bisureas, 4,4′-Methylenebis-(phenyl dimethylurea), 4,4′-diaminodiphenyl sulfone (4,4′-DDS), andBF₃.
 5. The composite structure of claim 1, wherein said thermosettingcomposition further comprises non-conductive fillers.
 6. The compositestructure of claim 1, wherein said non-conductive fillers compriseceramic microspheres.
 7. The composite structure of claim 1, whereinsaid at least one toughening agent is selected from the group consistingof: carboxylated nitriles, carboxyl-terminated butadiene acrylonitrile(CTBN), carboxyl-terminated polybutadiene (CTB), polyether sulfone,polyether ether ketone (PEEK), polyetherketoneketone (PEKK), liquidrubber, and core/shell rubber particles;
 8. The composite structure ofclaim 1, wherein said thermosetting composition further comprisesceramic microspheres and fumed silica, and said at least onemultifunctional epoxy resin comprises a combination of Diglycidyletherof Bisphenol A, Tetraglycidylether methylenedianiline, andDiglycidylether of Tetrabromo Bisphenol A, said at least one curingagent comprises dicyandiamide and bisureas, and said at least onetoughening agent comprises carboxylated nitrile and eithercarboxyl-terminated butadiene acrylonitrile (CTBN) orcarboxyl-terminated polybutadiene (CTB).
 9. The composite structure ofclaim 1, wherein said curable thermosetting composition furthercomprises a chain extension agent selected from the group consisting of:bisphenol A, tetrabromo bisphenol A (TBBA), bisphenol Z, tetramethylbisphenol A (TMBP-A), and bisphenol fluorines.
 10. The compositestructure of claim 1, wherein said thermosetting composition furthercomprises a UV stabilizer selected from the group consisting of:butylated hydroxytoluene (BHT), 2-hydroxy-4-methoxy-benzophenone,2,4-Bis(2,4-dimethylphenyl)-6-(2-hydroxy-4-octyloxyphenyl)-1,3,5-triazine,3,5-Di-tert-butyl-4-hydroxybenzoic acid, n-hexadecyl ester, titaniumdioxide, ultra-fine zinc oxide, and carbon black.
 11. A method of makinga composite structure comprising: (a) forming an electrically conductivefilm from a curable thermosetting composition comprising: i. at leastone multifunctional epoxy resin; ii. at least one curing agent selectedfrom the group consisting of: aromatic primary amines, bisureas, borontrifluoride complexes, and dicyandiamide; iii. at least one tougheningagent having a functional groups selected from epoxy groups, carboxylicacid groups, amino groups and hydroxyl groups capable of reacting withother components of the composition; and iv. conductive additives in anamount greater than about 35 wt. %, based on the total weight of thecomposition; (b) providing a curable, composite substrate comprised offibers impregnated with a matrix resin; (c) adhering the electricallyconductive film to the composite substrate; and (d) co-curing theelectrically conductive film with the composite substrate at atemperature in the range of 250° F. to 350° F., whereby saidelectrically conductive film has a resistivity of less than 500 mΩ/squpon curing.
 12. An electrically conductive surfacing film capable ofproviding lightning strike protection and electromagnetic interferenceshielding, said surfacing film comprising silver flakes distributedsubstantially uniformly throughout the film in a substantiallyinterconnected, lamellar configuration, and formed from a curablethermosetting composition comprising: a. at least one multifunctionalepoxy resin; b. at least one curing agent selected from the groupconsisting of: aromatic primary amines, bisureas, boron trifluoridecomplexes, and dicyandiamide; c. at least one toughening agent having afunctional groups selected from epoxy groups, carboxylic acid groups,amino groups and hydroxyl groups capable of reacting with othercomponents of the composition; and d. silver flakes in an amount greaterthan about 35 wt. %, based on the total weight of the composition; e.ceramic microspheres; and f. fumed silica, wherein said surfacing filmhas an electrical resistivity of less than 500 mΩ/sq, a film weight inthe range of 0.01-0.15 psf (pounds per square foot), and less than about1 wt. % of volatile content.
 13. The electrically conductive surfacingfilm of claim 12, wherein the curable thermosetting compositioncomprises: a. a combination of Diglycidylether of Bisphenol A and atleast one of Tetraglycidylether methylenedianiline and Diglycidyletherof Tetrabromo Bisphenol A; b. at least one curing agent selected fromthe group consisting of: dicyandiamide, bisureas, 4,4′-diaminodiphenylsulfone (4,4-DDS), and BF3; c. at least one toughening agent selectedfrom the group consisting of: carboxylated nitriles, carboxyl-terminatedbutadiene acrylonitrile (CTBN), carboxyl-terminated polybutadiene (CTB),polyether sulfone, and core/shell rubber particles; and d. silver flakesin an amount greater than about 35 wt. %, based on the total weight ofthe composition; e. ceramic microspheres; and f. fumed silica.